Colorado Digital Labs provides a comprehensive printed circuit board design service in addition to our electronics hardware design capabilities. As a critical component of any design, correct circuit layout is essential for proper circuit operation and low electromagnetic interference (EMI) emissions. All CDL printed circuit board artwork conforms to JEDEC and IPC standards and is supplied in RS-274-X Gerber format. Electronic packaging technologies include Through Hole(TH), Surface Mount(SMT), Mixed TH/SMT on 1 or 2 sides, Chip on Board (COB) and Thick Film on any substrate. Our Gallery page shows some examples of printed circuit board assemblies we have created for our customers.
Electronic packaging strategy is determined by several factors. Surface Mount, COB and Thick Film packaging is generally used for automated assembly in high volume production, or where physical size of the circuit board assembly is an issue. Through Hole component mounting is sometimes best for extreme environments, prototyping and low volume production runs.
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